Editor: Rasit O. Topaloglu

Recent Topics on Modeling of Semiconductor Processes, Devices, and Circuits

Volume 1

eBook: US $44 Special Offer (PDF + Printed Copy): US $140
Printed Copy: US $119
Library License: US $176
ISBN: 978-1-60805-695-8 (Print)
ISBN: 978-1-60805-074-1 (Online)
Year of Publication: 2011
DOI: 10.2174/97816080507411110101

Introduction

The last couple of years have been very busy for the semiconductor industry and researchers. The rapid speed of production channel length reduction has brought lithographic challenges to semiconductor modeling. These include stress optimization, transistor reliability and efficient circuit design with respect to interconnects, power and leakage at the chip level. This e-book focuses on the latest semiconductor techniques devised to address these issues. It should be a useful resource for electronic engineers and semiconductor chip designers.

Foreword

- Pp. i-iii (3)
Andrew B. Kahng
Download Free

Preface

- Pp. iv
Rasit O. Topaloglu and Peng Li
Download Free

List of Contributors

- Pp. v
Rasit O. Topaloglu and Peng Li
View Abstract Download Free

Acknowledgements

- Pp. vi
Rasit O. Topaloglu and Peng Li
Download Free

A Brief Overview of Lithographic Advancements in the Last Decade with a Focus on Double Patterning

- Pp. 3-20 (18)
Jongwook Kye and Rasit O. Topaloglu

PDF Price: $15

View Abstract Purchase Chapter

Interconnect Variability and Performance Analysis

- Pp. 21-39 (19)
Rasit Onur Topaloglu, Zhuo Feng and Peng Li

PDF Price: $15

View Abstract Purchase Chapter

Compact Modeling for NBTI and CHC Effects

- Pp. 40-60 (21)
Wenping Wang, Vijay Reddy, Srikanth Krishnan and Yu Cao

PDF Price: $15

View Abstract Purchase Chapter

Probability Propagation and Yield Optimization for Analog Circuits

- Pp. 61-80 (20)
Rasit O. Topaloglu, Guo Yu and Peng Li

PDF Price: $15

View Abstract Purchase Chapter

Compact Modeling of Engineered Strain

- Pp. 81-119 (39)
Richard Q. Williams

PDF Price: $15

View Abstract Purchase Chapter

Chip-Level Statistical Leakage Modeling and Analysis

- Pp. 120-148 (29)
Sheldon X.-D. Tan and Ruijing Shen

PDF Price: $15

View Abstract Purchase Chapter

Mathematical Method for VLSI Thermal Simulation at the System and Circuit Levels

- Pp. 149-166 (18)
Dongkeun Oh, Charlie Chung Ping Chen and Yu Hen Hu

PDF Price: $15

View Abstract Purchase Chapter

Noise-Driven In-Package Decoupling Capacitor Optimization for Power Integrity

- Pp. 167-188 (22)
Yiyu Shi, Hao Yu and Lei He

PDF Price: $15

View Abstract Purchase Chapter

Index

- Pp. 189-191 (3)
Rasi Onur Topaloglu and Peng Li
View Abstract Download Free

RELATED BOOKS

.Modern Intelligent Instruments - Theory and Application.
.Bipolar Transistor and MOSFET Device Models.
.Electromagnetic Interference Issues in Power Electronics and Power Systems.
.Electromagnetics for Engineering Students: Part 1.
.Micro and Nanomachining Technology-Size, Model and Complex Mechanism.
.The Mechanical Vibration: Therapeutic Effects and Applications.
.Advances in Multiphase Flow and Heat Transfer.
.Fiber Bragg Grating Sensors: Recent Advancements, Industrial Applications and Market Exploitation.