Editor: Rasit O. Topaloglu

Recent Topics on Modeling of Semiconductor Processes, Devices, and Circuits

Volume 1

eBook: US $44 Special Offer (PDF + Printed Copy): US $141
Printed Copy: US $119
Library License: US $176
ISBN: 978-1-60805-695-8 (Print)
ISBN: 978-1-60805-074-1 (Online)
Year of Publication: 2011
DOI: 10.2174/97816080507411110101


The last couple of years have been very busy for the semiconductor industry and researchers. The rapid speed of production channel length reduction has brought lithographic challenges to semiconductor modeling. These include stress optimization, transistor reliability and efficient circuit design with respect to interconnects, power and leakage at the chip level. This e-book focuses on the latest semiconductor techniques devised to address these issues. It should be a useful resource for electronic engineers and semiconductor chip designers.


- Pp. i-iii (3)
Andrew B. Kahng
Download Free


- Pp. iv
Rasit O. Topaloglu, Peng Li
Download Free

List of Contributors

- Pp. v
Rasit O. Topaloglu, Peng Li
View Abstract


- Pp. vi
Rasit O. Topaloglu, Peng Li
Download Free

A Brief Overview of Lithographic Advancements in the Last Decade with a Focus on Double Patterning

- Pp. 3-20 (18)
Jongwook Kye, Rasit O. Topaloglu
View Abstract

Interconnect Variability and Performance Analysis

- Pp. 21-39 (19)
Rasit Onur Topaloglu, Zhuo Feng, Peng Li
View Abstract

Compact Modeling for NBTI and CHC Effects

- Pp. 40-60 (21)
Wenping Wang, Vijay Reddy, Srikanth Krishnan, Yu Cao
View Abstract

Probability Propagation and Yield Optimization for Analog Circuits

- Pp. 61-80 (20)
Rasit O. Topaloglu, Guo Yu, Peng Li
View Abstract

Compact Modeling of Engineered Strain

- Pp. 81-119 (39)
Richard Q. Williams
View Abstract

Chip-Level Statistical Leakage Modeling and Analysis

- Pp. 120-148 (29)
Sheldon X.-D. Tan, Ruijing Shen
View Abstract

Mathematical Method for VLSI Thermal Simulation at the System and Circuit Levels

- Pp. 149-166 (18)
Dongkeun Oh, Charlie Chung Ping Chen, Yu Hen Hu
View Abstract

Noise-Driven In-Package Decoupling Capacitor Optimization for Power Integrity

- Pp. 167-188 (22)
Yiyu Shi, Hao Yu, Lei He
View Abstract


- Pp. 189-191 (3)
Rasi Onur Topaloglu, Peng Li
View Abstract


.Solid State & Microelectronics Technology.
.Voltammetry for Sensing Applications.
.Modern Intelligent Instruments - Theory and Application.
.Bipolar Transistor and MOSFET Device Models.
.Intelligent Technologies for Research and Engineering.
.Intelligent Technologies for Automated Electronic Systems.
.Multistage Interconnection Network Design for Engineers.
. Mechanical Engineering Technologies and Applications Vol. 3.