Foreword

Instant Bonding Epoxy Technology describes in a comprehensive manner the fundamental theory and application knowledge of epoxy adhesive formulation technology with a focus on the latest developments—for the first time —in instant bonding epoxy technology and application: UV cure cationic epoxy, dual cure hybrid epoxy, snap thermal cure epoxy, induction cure epoxy, and snap ambient cure epoxy technologies. Written by an internationally leading expert with long-time working experience in epoxy adhesive technology, Instant Bonding Epoxy Technology is an invaluable resource for researchers, formulation chemists, and application engineers related to polymer science and technology in both academia and industry.

Dr. Chen deserves praise and thanks from the adhesion and adhesive community for distilling his vast experience in this book. All those involved or interested in adhesive bonding will find this book an indispensable reference.