Chapter 7

Numerical Study of the Influence of Nano-fluid Type on Thermal Improvement in a Three Dimensional Mini Channel

Kamel Chadi*, Nora Boultif, Nourredine Belghar, Aymen Mohamed Kethiri, Zied Driss and Belhi Guerira

Abstract

With the increasing development in the field of electronics, electronic devices have become smaller in size and more heat dissipating. This excessive heat leads to damage to the electronic components, and also their performance becomes bad. Therefore, the process of cooling them must be improved to increase their effectiveness in performance. For this purpose, we performed a numerical study to investigate the effect of different nanofluids on heat exchange in a silicon mini channel cooler for cooling electronic components. Three different types of nano-fluids were considered (TiO2-H2O, Ag-H2O, and SWCNT-H2O). In this study, the volumetric fraction of nanoparticles is taken to be 2%, the Reynolds number (Re) is varied between 100 and 700, and the flow regime is assumed to be stationary. The ANSYS Fluent 17.1 commercial software is used as a calculation tool to solve the governing equations, which depend on the finite volume method (FVM) in its solution. The relaxation of decreasing factors used in this study is 0.7 and 0.3 to maintain momentum and pressure, respectively. The residual values of the continuity equation and velocity components are in the range of 10-5 and 10-6, respectively, and the second-order upwind scheme has been used. The results obtained show that the maximum temperature of the electronic component decreases with the increase in the Reynolds number. The reduction in the temperature of the electronic component is more noticeable for the TiO2-water and SWCNT water nano-fluid. As we found that the values of the coefficient of heat exchange between the channel walls and the nano-fluid that contains the single-walled carbon nanotubes nanoparticles are the highest compared to the nanoparticles that do not contain carbon in their composition, therefore, this condition can be considered the best in heat transfer. Therefore, it is recommended that nanofluids containing nanoparticles SWCNT for cooling high-temperature electronic components should be used.

Total Pages: 87-100 (14)

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