Recent Topics on Modeling of Semiconductor Processes, Devices, and Circuits

Volume 1


Rasit O. Topaloglu

DOI: 10.2174/97816080507411110101
eISBN: 978-1-60805-074-1, 2011
ISBN: 978-1-60805-695-8

Indexed in: Scopus, EBSCO.

The last couple of years have been very busy for the semiconductor industry and researchers. The rapid speed of production channel len...[view complete introduction]
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Mathematical Method for VLSI Thermal Simulation at the System and Circuit Levels

- Pp. 149-166 (18)

Dongkeun Oh, Charlie Chung Ping Chen and Yu Hen Hu


As the integration density of on-chip transistors increases, high power density exacerbates the reliability of integrated circuits (ICs), limiting their performance. As a result, sophisticated thermalmanagement becomes a key to design reliable and high-performance ICs, which requiring an accurate and efficient thermal simulation framework. However, due to the large computational cost of general-purpose thermal simulators, we need a dedicated one that is optimized for each specific application. In this chapter, first, we will discuss the various thermal simulation algorithms optimized for each target application, particularly at the system and circuit-levels. Second, we present a detailed analytical formula dedicated to circuit-level steady-state thermal simulation. Finally, we compare computational cost of all circuit-level thermal simulation methods in terms of the computational cost.

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